BGA package underfill

DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in industrial adhesives for semiconductor,home applicance and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed industrial adhesives for chip packaging and testing, circuit board-level adhe- sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.

Address: 7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park, Long- hua District, Shenzhen, Guangdong, China

Phone: (+86)-13825524136

Email: info@deepmaterialcn.com

Website: https://www.deepmaterialcn.com/bga-package-underfill.html